3D Printing High‐Performance Piezoelectric Ceramic with Complex Structure for Ultrasonic Array Transducer

Abstract

Abstract 3D printing has demonstrated irreplaceable advantages on rapid prototyping and flexible shaping of piezoelectric ceramic fabrication. However, several factors such as microstructure, densification, inferior electrical properties, and practical device design, significantly limit the applications of 3D‐printed piezoelectric ceramics. In this work, a method of utilizing the digital light processing technique to manufacture high‐performance piezoelectric Sm‐PMN‐PT ceramics with complex geometries for devices application is realized. The piezoelectric coefficient d 33 of 1285 pC N −1 is achieved, which represents the highest value reported to date among all 3D‐printed piezoelectric ceramics. Furthermore, an ultrasonic transducer annular array, which is challenging to achieve using traditional manufacture techniques, is designed and fabricated through 3D printing. The transducer demonstrates exceptional performance with a large bandwidth of 60%, a high peak‐to‐peak voltage of 952 mV, and improved imaging resolutions. Notably, the superior performance establishes a new benchmark in the achievable device level for 3D‐printed ultrasonic transducers. These results highlight the significant potential of 3D‐printed piezoelectric ceramics and complex structures on devices, showcasing their capability to fulfill specific needs and requirements.