A Universal van der Waals Tunneling Injector for Monolayer CMOS

H Hanbin Cho (Department of Chemical and Biomolecular Engineering Korea Advanced Institute of Science and Technology (KAIST) Daejeon Republic of Korea) J Jing Huang S Seonguk Yang (Department of Chemical and Biomolecular Engineering Korea Advanced Institute of Science and Technology (KAIST) Daejeon Republic of Korea) S Subin Im (Center for Semiconductor Technology Korea Institute of Science and Technology Seoul Republic of Korea) S Sangwoo Park J Jeongin Yeo (Department of Materials Science and Engineering Ulsan National Institute of Science and Technology Ulsan Republic of Korea) S Sungyeon Kim (Department of Materials Science and Engineering Ulsan National Institute of Science and Technology Ulsan Republic of Korea) G Gilhwan Do (Department of Chemical and Biomolecular Engineering Korea Advanced Institute of Science and Technology (KAIST) Daejeon Republic of Korea) W Wenxuan Zhu S Soobeom Shin (Graduate School of Semiconductor Materials and Devices Engineering Ulsan National Institute of Science and Technology Ulsan Republic of Korea) J Jongwon Lee (Department of Neurobiology, University of Pittsburgh School of Medicine) Y Yongjoon Shin D Do‐Sun Lee (Semiconductor R&D Center Samsung Electronics Co., Ltd. Hwaseong Republic of Korea) H Hu Young Jeong T Tae‐Eon Park (Center for Semiconductor Technology Korea Institute of Science and Technology Seoul Republic of Korea) J Jun Kang K Kyungmin Ko (Division of AI Semiconductor Yonsei University Wonju Republic of Korea) J Joonki Suh

Abstract

ABSTRACT Two‐dimensional (2D) semiconductors are poised to extend logic technology to the atomic‐thickness limit, yet monolayer complementary metal‐oxide‐semiconductor (CMOS) has been largely hampered by polarity‐dependent, thermionic‐emission‐dominated contacts that preclude a unified injection solution. Here, we introduce degenerately doped, crystalline SnSe 2 as a universal source‐side van der Waals (vdW) injector capable of enforcing all‐tunneling carrier injection into both p ‐ and n ‐type monolayer channels. The combination of a large electron affinity (∼5.1 eV), degenerate carrier density (>10 19 cm −3 ), and atomically uniform vdW interfacial coupling enables polarity‐tailored tunneling mechanisms while effectively suppressing interfacial gap states. In p ‐type WSe 2 , a type‐III (broken gap) alignment drives efficient band‐to‐band tunneling, yielding a >1000‐fold enhancement in drive current over conventional metal electrodes. In n ‐type MoS 2 , the SnSe 2 injector forms a type‐I heterojunction within the sub‐depletion‐width monolayer body, enabling a gate‐tunable injection that evolves from field‐controlled Fowler–Nordheim‐like tunneling to thickness‐limited tunneling, achieving an on/off ratio > 10 9 and a subthreshold swing below 70 mV dec −1 . Integrating this single‐material injector, we demonstrate a monolayer CMOS inverter with a maximum voltage gain of ∼340 at V DD = 2 V, establishing degenerate SnSe 2 as a dual‐polarity vdW injector and providing a platform for high‐performance, low‐power 2D integrated circuits.

Article Details

Volume / Issue Vol. 1, Issue 1
Published August 12, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (18)

H

Hanbin Cho

Department of Chemical and Biomolecular Engineering Korea Advanced Institute of Science and Technology (KAIST) Daejeon Republic of Korea

J

Jing Huang

S

Seonguk Yang

Department of Chemical and Biomolecular Engineering Korea Advanced Institute of Science and Technology (KAIST) Daejeon Republic of Korea

S

Subin Im

Center for Semiconductor Technology Korea Institute of Science and Technology Seoul Republic of Korea

S

Sangwoo Park

J

Jeongin Yeo

Department of Materials Science and Engineering Ulsan National Institute of Science and Technology Ulsan Republic of Korea

S

Sungyeon Kim

Department of Materials Science and Engineering Ulsan National Institute of Science and Technology Ulsan Republic of Korea

G

Gilhwan Do

Department of Chemical and Biomolecular Engineering Korea Advanced Institute of Science and Technology (KAIST) Daejeon Republic of Korea

W

Wenxuan Zhu

S

Soobeom Shin

Graduate School of Semiconductor Materials and Devices Engineering Ulsan National Institute of Science and Technology Ulsan Republic of Korea

J

Jongwon Lee

Department of Neurobiology, University of Pittsburgh School of Medicine

Y

Yongjoon Shin

D

Do‐Sun Lee

Semiconductor R&D Center Samsung Electronics Co., Ltd. Hwaseong Republic of Korea

H

Hu Young Jeong

T

Tae‐Eon Park

Center for Semiconductor Technology Korea Institute of Science and Technology Seoul Republic of Korea

J

Jun Kang

K

Kyungmin Ko

Division of AI Semiconductor Yonsei University Wonju Republic of Korea

J

Joonki Suh