Activation‐Free Liquid‐Metal Composite Elastomers via Ultrasonic‐Enabled Interface Welding for Strain‐Insensitive Electronics

T Tong Zheng H Haiyang Qin (College of Chemistry Nankai University Tianjin China) Q Qiongfeng Shi S Shengxin Xiang Q Qinzhu Jiang (School of Electronic Science and Engineering Southeast University Nanjing China) J Jianwei Li (Macao Institute of Materials Science and Engineering (MIMSE), Faculty of Innovation Engineering, Macau University of Science and Technology, Taipa, 999078 Macao, China) C Chenhui Xu (School of Electronic Science and Engineering Southeast University Nanjing China) X Xiao Wei (State Key Laboratory of Bioinspired Interfacial Materials Science, Suzhou Institute for Advanced Research) L Lei Liu X Xinkai Xie (School of Electronic Science and Engineering Southeast University Nanjing China) Z Zhirong Liu (Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology, Luoyu Road 1037, Wuhan 430074 Hubei, People’s Republic of China) G Guozhen Shen J Jun Wu

Abstract

ABSTRACT Liquid metal (LM)‐based stretchable electronics are often limited by their native insulating oxide shell, typically necessitating destructive post‐activation or resulting in blends with limited extreme‐strain capabilities. Herein, we report an activation‐free LM composite elastomer (ALCE) featuring a robust metallurgical interface between LM nanoparticles and silver nanowires (Ag NWs). Unlike conventional physical mixing, we harness acoustic cavitation to facilitate in situ alloying. As the solvent subsequently evaporates, the welded components preferentially sediment to yield a macroscopic gradient architecture. This establishes a continuous conductive bottom network protected by a polymer‐rich upper layer, delivering a conductivity of 2.4 × 10 6 S/m. Benefiting from these robust welded junctions, the ALCE exhibits a distinctive initial decrease in resistance up to 400% strain, compensating for deformation‐induced resistance increases to achieve exceptional strain insensitivity ( R/R 0 = 1.8 at 1200% strain). Finally, we demonstrate its practical performance with robust stretchable sensors and a skin‐conformable human‐animal interactive system, establishing a scalable strategy toward high‐performance bioelectronics.

Article Details

Volume / Issue Vol. 1, Issue 1
Published July 25, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (13)

T

Tong Zheng

H

Haiyang Qin

College of Chemistry Nankai University Tianjin China

Q

Qiongfeng Shi

S

Shengxin Xiang

Q

Qinzhu Jiang

School of Electronic Science and Engineering Southeast University Nanjing China

J

Jianwei Li

Macao Institute of Materials Science and Engineering (MIMSE), Faculty of Innovation Engineering, Macau University of Science and Technology, Taipa, 999078 Macao, China

C

Chenhui Xu

School of Electronic Science and Engineering Southeast University Nanjing China

X

Xiao Wei

State Key Laboratory of Bioinspired Interfacial Materials Science, Suzhou Institute for Advanced Research

L

Lei Liu

X

Xinkai Xie

School of Electronic Science and Engineering Southeast University Nanjing China

Z

Zhirong Liu

Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology, Luoyu Road 1037, Wuhan 430074 Hubei, People’s Republic of China

G

Guozhen Shen

J

Jun Wu