Advances in Low‐Temperature Co‐Fired Ceramics for Next‐Generation Electronics Applications

Abstract

ABSTRACT Low‐temperature co‐fired ceramics (LTCC) with unique multilayer interconnection architectures are indispensable for electronic communication devices and high‐density integrated packaging, facing stringent demands in millimeter‐wave and higher‐frequency applications. This review highlights recent advances in optimizing the comprehensive performance of LTCCs and proposes strategies for further enhancement to meet the ever‐growing demands of high‐performance microwave devices and systems. Specifically, LTCC material designs tailored to achieve desirable properties are discussed, including appropriate permittivity, low dielectric loss, a near‐zero temperature coefficient of resonant frequency, high thermal conductivity, matched coefficient of thermal expansion, and excellent mechanical strength. Additionally, innovations in sintering technologies are highlighted, such as ultra‐low temperature co‐fired ceramic (ULTCC) technology and cold sintering process (CSP). These approaches further reduce sintering temperatures, enabling LTCCs to integrate with a broader range of materials (e.g., silicon chips, aluminum electrodes, 2D materials, and polymers) that were previously incompatible with traditional high‐temperature processes. Finally, this review offers insights into the future development directions of LTCCs in emerging applications, including 3D integration and advanced packaging, integrated communication and sensing systems, and millimeter‐wave/terahertz integrated miniaturized devices for next‐generation electronics.