Artificial Intelligence‐Driven Approaches in Semiconductor Research

Y Yiqiang Zheng (State Key Laboratory of Semiconductor Physics and Chip Technologies Institute of Semiconductors Chinese Academy of Sciences Beijing 100083 China) H Hao Xu Z Zhexin Li L Linlin Li (College of Materials Science and Technology) Y Yongchao Yu P Pengfei Jiang (School of Life Sciences, The National Engineering Laboratory of Crop Resistance Breeding, Anhui Agricultural University) Y Yanmeng Shi (Department of Physics and Astronomy University of Manchester Manchester M13 9PL UK) J Jing Zhang Y Yuqing Huang (State Key Laboratory of Semiconductor Physics and Chip Technologies, Institute of Semiconductors) Q Qing Luo Z Zheng Lou L Lili Wang (Department of Chemistry)

Abstract

Abstract To address the persistent challenges of scaling and power consumption in integrated circuits and chips, recent research has focused on exploring novel semiconductor materials beyond silicon and designing new device architectures. The vastness of the material and parameter space poses significant challenges in terms of cost and efficiency for traditional experimental and computational methods. The rise of artificial intelligence (AI) offers a highly promising avenue for accelerating semiconductor technology development. AI‐driven methods demonstrate significant advantages in analyzing and interpreting large datasets, potentially freeing researchers to focus on more creative endeavors. This review provides a detailed and timely overview of how AI‐driven approaches are assisting researchers across the entire semiconductor research pipeline, encompassing materials discovery, semiconductor screening, synthesis, characterization, and device performance optimization, highlighting how their integration facilitates a holistic understanding of the entire processing‐structure‐property‐performance (PSPP) relationship. Remain challenges related to dataset quality, model generalizability, and autonomous experimentation, as well as the under‐application of AI to critical needs are discussed in the semiconductor field, such as wafer‐scale growth of high‐quality, single‐crystal semiconductor thin films beyond silicon. Addressing these challenges requires collaborative efforts from researchers across various organizations and disciplines, and represents a key focus for future research.

Article Details

Volume / Issue Vol. 37, Issue 35
Published September 01, 2025
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (12)

Y

Yiqiang Zheng

State Key Laboratory of Semiconductor Physics and Chip Technologies Institute of Semiconductors Chinese Academy of Sciences Beijing 100083 China

H

Hao Xu

Z

Zhexin Li

L

Linlin Li

College of Materials Science and Technology

Y

Yongchao Yu

P

Pengfei Jiang

School of Life Sciences, The National Engineering Laboratory of Crop Resistance Breeding, Anhui Agricultural University

Y

Yanmeng Shi

Department of Physics and Astronomy University of Manchester Manchester M13 9PL UK

J

Jing Zhang

Y

Yuqing Huang

State Key Laboratory of Semiconductor Physics and Chip Technologies, Institute of Semiconductors

Q

Qing Luo

Z

Zheng Lou

L

Lili Wang

Department of Chemistry