Colossal Electromechanical Response in Antiferroelectric‐based Nanoscale Multilayers

M Megha Acharya (Department of Materials Science and Engineering University of California, Berkeley Berkeley CA 94720 USA) L Louis Alaerts (Thayer School of Engineering Dartmouth College Hanover NH 03755 USA) E Ella Banyas (Materials Sciences Division Lawrence Berkeley National Laboratory Berkeley CA 94720 USA) D Deokyoung Kang (Rice Advanced Materials Institute) F Francesco Ricci (Department of Chemical Sciences and Technologies, University of Rome, Tor Vergata, Via della Ricerca Scientifica, Rome 00133, Italy) H Hao Pan B Brendan Hanrahan (U.S. Army Combat Capabilities Development Command-Army Research Laboratory 2 , Adelphi, Maryland 20783,) J Jonathan E. Spanier (Department of Mechanical Engineering and Mechanics, Drexel University) J Jeffery B. Neaton (Materials Sciences Division Lawrence Berkeley National Laboratory Berkeley CA 94720 USA) G Geoffroy Hautier (Thayer School of Engineering) L Lane W. Martin (Rice Advanced Materials Institute)

Abstract

AbstractThe pursuit of smaller, energy‐efficient devices drives the exploration of electromechanically active thin films (<1 µm) to enable micro‐ and nano‐electromechanical systems. While the electromechanical response of such films is limited by substrate‐induced mechanical clamping, large electromechanical responses in antiferroelectric and multilayer thin‐film heterostructures have garnered interest. Here, multilayer thin‐film heterostructures based on antiferroelectric PbHfO3 and ferroelectric PbHf1‐xTixO3 overcome substrate clamping to produce electromechanical strains >4.5%. By varying the chemistry of the PbHf1‐xTixO3 layer (x = 0.3‐0.6) it is possible to alter the threshold field for the antiferroelectric‐to‐ferroelectric phase transition, reducing the field required to induce the onset of large electromechanical response. Furthermore, varying the interface density (from 0.008 to 3.1 nm−1) enhances the electrical‐breakdown field by >450%. Attaining the electromechanical strains does not necessitate creating a new material with unprecedented piezoelectric coefficients, but developing heterostructures capable of withstanding large fields, thus addressing traditional limitations of thin‐film piezoelectrics.

Article Details

Volume / Issue Vol. 37, Issue 14
Published April 01, 2025
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (11)

M

Megha Acharya

Department of Materials Science and Engineering University of California, Berkeley Berkeley CA 94720 USA

L

Louis Alaerts

Thayer School of Engineering Dartmouth College Hanover NH 03755 USA

E

Ella Banyas

Materials Sciences Division Lawrence Berkeley National Laboratory Berkeley CA 94720 USA

D

Deokyoung Kang

Rice Advanced Materials Institute

F

Francesco Ricci

Department of Chemical Sciences and Technologies, University of Rome, Tor Vergata, Via della Ricerca Scientifica, Rome 00133, Italy

H

Hao Pan

B

Brendan Hanrahan

U.S. Army Combat Capabilities Development Command-Army Research Laboratory 2 , Adelphi, Maryland 20783,

J

Jonathan E. Spanier

Department of Mechanical Engineering and Mechanics, Drexel University

J

Jeffery B. Neaton

Materials Sciences Division Lawrence Berkeley National Laboratory Berkeley CA 94720 USA

G

Geoffroy Hautier

Thayer School of Engineering

L

Lane W. Martin

Rice Advanced Materials Institute