Crossing the Dimensional Divide with Optoelectronic Tweezers: Multicomponent Light‐Driven Micromachines with Motion Transfer in Three Dimensions
Abstract
Abstract Micromachines capable of performing diverse mechanical tasks in complex and constrained microenvironments are of great interest. Despite important milestones in this pursuit, until now, micromachines are confined to actuation within a single 2D plane due to the challenges of transferring motion across different planes in limited space. Here, a breakthrough method is presented to overcome this limitation: multi‐component micromachines that facilitate 3D motion transfer across different planes. These light‐driven 3D micromachines, fabricated using standard photolithography combined with direct laser writing, are assembled and actuated via programmable light patterns within an optoelectronic tweezers system. Utilizing charge‐induced repulsion and dielectrophoretic levitation effects, the micromachines enable highly efficient mechanical rotation and effective inter‐component motion transfer. Through this work, fascinating patterns of similarities are unveiled for the new microscale 3D systems when compared with the macro‐scale world in which they live, paving the way for the development of micromechanical devices and microsystems with ever increasing functionality and versatility.
Article Details
Authors (18)
Gong Li
Bingrui Xu
Beijing Advanced Innovation Center for Intelligent Robots and Systems School of Mechatronical Engineering Beijing Institute of Technology Beijing 100081 China
Xiaopu Wang
Jiangfan Yu
Yifan Zhang
Rongxin Fu
Zhengzhou Research Institute, Beijing Institute of Technology
Fan Yang
Hongcheng Gu
Yuchen Huang
Yujie Chen
Yanfeng Zhang
School of Chemistry, Institute of New Concept Sensors and Molecular Materials (INCSMM), State Key Laboratory of Fluorine & Nitrogen Chemicals, Engineering Research Center of Energy Storage Materials and Devices, Ministry of Education, Xi’an Key Laboratory of Sustainable Polymer Materials
Zhuoran Wang
Guozhen Shen
Yeliang Wang
School of Integrated Circuits and Electronics, MIIT Key Laboratory for Low-Dimensional Quantum Structure and Devices
Huikai Xie
Engineering Research Center of Integrated Acousto-opto-electronic Microsystems (Ministry of Education of China), Beijing Institute of Technology, Chongqing Institute of Microelectronics and Microsystems
Aaron R. Wheeler
Institute of Biomedical Engineering University of Toronto Toronto ON M5S 3E1 Canada
Jiafang Li
State Key Laboratory of Chips and Systems for Advanced Light Field Display, School of Optics and Photonics, Beijing Institute of Technology
Shuailong Zhang
School of Integrated Circuits and Electronic, Engineering Research Center of Integrated Acousto-optoelectronic Microsystem (Ministry of Education of China)