Diffraction‐Free Omnidirectional Antireflection Binary Metasurface via Femtosecond Laser Hybrid Etching

X Xin‐Ran Yuan (State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China) X Xin Zhang L Lei Wang X Xiang‐Chao Sun (State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China) Z Zhi‐Juan Sun (State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China) Y Ya‐Kui Sun (State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China) Z Zhi‐Yong Hu (State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China) C Chun‐Qi Jin (State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China) Q Qi‐Dai Chen (State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China) X Xue‐Qing Liu (State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China)

Abstract

ABSTRACT An ideal anti‐reflection window requires both diffraction‐free transmission and mechanical robustness, which poses significant challenges for hard and brittle materials. Conventional subwavelength structures often achieve diffraction‐free transmission by either reducing the periodicity or increasing aspect ratio yet low processing efficiency hinders scalable fabrication. Herein, we propose a novel cone‐cylinder binary metasurface that overcomes the limitations of traditional subwavelength designs by exploiting multi‐mode resonance and phase compensation. This synergy enables non‐diffractive transmission in a scalable non‐subwavelength sapphire architecture. To realize the metasurface, we developed a femtosecond laser penetrating hybrid etching (FsLPE) technique, which enables the fabrication of centimeter‐scale mid‐infrared broadband windows on sapphire. The resulting device exhibits a peak transmittance of 98.3% at 5 µm, an average transmittance exceeding 92.0%, and minimal degradation (0.3%) even at a 50° incidence angle. Moreover, the window withstands temperatures up to 1200°C, demonstrating great potential for applications in infrared optical systems and optical sensing under extreme environmental conditions.

Article Details

Volume / Issue Vol. 38, Issue 28
Published May 01, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (10)

X

Xin‐Ran Yuan

State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China

X

Xin Zhang

L

Lei Wang

X

Xiang‐Chao Sun

State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China

Z

Zhi‐Juan Sun

State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China

Y

Ya‐Kui Sun

State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China

Z

Zhi‐Yong Hu

State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China

C

Chun‐Qi Jin

State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China

Q

Qi‐Dai Chen

State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China

X

Xue‐Qing Liu

State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering Jilin University Changchun China