High‐Modulus and High‐Damping Ionic Polymers Enabled by Cohesive Entanglement

Z Ziyang Liu X Xiaowei Wang M Minzhi Duan (School of Chemistry and Chemical Engineering Nanjing University Nanjing China) M Ming Wu Q Qingning Li (Jiangsu Engineering Laboratory of Novel Functional Polymeric Materials, Jiangsu Key Laboratory of Advanced Negative Carbon Technologies, Suzhou Key Laboratory of Soft Material and New Energy, College of Chemistry, Chemical Engineering and Materials Science, Soochow University) J Jiaofeng Xiong (Jiangsu Engineering Laboratory of Novel Functional Polymeric Materials, Jiangsu Key Laboratory of Advanced Negative Carbon Technologies, Suzhou Key Laboratory of Soft Material and New Energy, College of Chemistry, Chemical Engineering and Materials Science, Soochow University) X Xiaoliang Wang (Department of Chemistry) W Weizheng Li (Jiangsu Engineering Laboratory of Novel Functional Polymeric Materials, Jiangsu Key Laboratory of Advanced Negative Carbon Technologies, Suzhou Key Laboratory of Soft Material and New Energy, College of Chemistry, Chemical Engineering and Materials Science, Soochow University) F Feng Yan (Materials Science and Engineering Program, School for Engineering of Matter, Transport and Energy)

Abstract

ABSTRACT High‐modulus polymers typically derive their properties from high crosslinking density and strong intermolecular interactions. In contrast, high‐damping polymers primarily dissipate energy via the sliding and friction of mobile molecular segments. This fundamental contradiction creates an inherent trade‐off, rendering the simultaneous achievement of high modulus and high damping a significant challenge. Herein, we report rigid‐damping amphoteric ionic polymers (AIPs) developed through a cohesive entanglement strategy governed by side‐chain ionic interactions. Synthesized via acid–base neutralization, these AIPs simultaneously achieve a high Young's modulus of 0.9 GPa and a damping coefficient (loss factor, tan δ) of up to 1.5. This breakthrough proposes a strategy to balance the modulus‐damping trade‐off and highlights the material's potential for advanced impact‐resistant applications, such as transparent coatings for electronic devices and vibration‐damping systems.

Article Details

Volume / Issue Vol. 38, Issue 13
Published March 01, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (9)

Z

Ziyang Liu

X

Xiaowei Wang

M

Minzhi Duan

School of Chemistry and Chemical Engineering Nanjing University Nanjing China

M

Ming Wu

Q

Qingning Li

Jiangsu Engineering Laboratory of Novel Functional Polymeric Materials, Jiangsu Key Laboratory of Advanced Negative Carbon Technologies, Suzhou Key Laboratory of Soft Material and New Energy, College of Chemistry, Chemical Engineering and Materials Science, Soochow University

J

Jiaofeng Xiong

Jiangsu Engineering Laboratory of Novel Functional Polymeric Materials, Jiangsu Key Laboratory of Advanced Negative Carbon Technologies, Suzhou Key Laboratory of Soft Material and New Energy, College of Chemistry, Chemical Engineering and Materials Science, Soochow University

X

Xiaoliang Wang

Department of Chemistry

W

Weizheng Li

Jiangsu Engineering Laboratory of Novel Functional Polymeric Materials, Jiangsu Key Laboratory of Advanced Negative Carbon Technologies, Suzhou Key Laboratory of Soft Material and New Energy, College of Chemistry, Chemical Engineering and Materials Science, Soochow University

F

Feng Yan

Materials Science and Engineering Program, School for Engineering of Matter, Transport and Energy