Leaftronics: Bio‐Fractal Scaffolds From Leaf Venation for Low‐Waste Electronics

Abstract

ABSTRACT The rising levels of electronic waste, projected to surpass 82 million metric tons annually by 2030, highlight the need for sustainable materials in electronics. Continued reliance on non‐decomposable substrates (glass, FR4‐epoxy laminates, plastic foils, etc.) and scarce transparent conductors as electrodes will only intensify pollution and high‐emission manufacturing. A decomposable platform compatible with reflow soldering and thin‐film device fabrication could address these gaps. Here, the emerging field of “Leaftronics” offers a solution by extracting quasi‐fractal lignocellulosic venation from leaves to form robust scaffolds that integrate solution‐processed biopolymers into high‐performance substrates or, when metallized, transparent electrodes for optoelectronics. We discuss how leaf‐derived structures help to fabricate flexible, transparent substrates with <1 nm surface roughness, support reflow‐soldered circuits, vapor‐deposited devices, printed transistors, and batteries. The approach demonstrates full decomposability, component recovery, and >90% reduced carbon footprint (cradle‐to‐gate) versus conventional approaches. Recent advances in fractal metallization for superior transparent electrodes are reviewed, suggesting leaf venation as a model for enhancing bio‐composites using natural hierarchies. Pathways to translation and future research horizons are outlined. By merging evolutionary designs with biopolymers, “Leaftronics” paves a scalable path to low‐waste electronics, inspiring interdisciplinary investigations in biomimetic materials and sustainable device architectures.