Liquid Metal‐Vitrimer Conductive Composite for Recyclable and Resilient Electronics

D Dong Hae Ho (Mechanical Engineering Soft Materials and Structures Lab Virginia Tech Blacksburg VA 24061 USA) M Meng Jiang R Ravi Tutika (Department of Mechanical Engineering, Soft Materials and Structures Lab, Virginia Tech) J Joshua C. Worch (Department of Chemistry and Macromolecules Innovation Institute Virginia Tech Blacksburg Virginia USA) M Michael D. Bartlett (Department of Mechanical Engineering, Soft Materials and Structures Lab, Virginia Tech)

Abstract

Abstract Electronic devices are ubiquitous in modern society, yet their poor recycling rates contribute to substantial economic losses and worsening environmental impacts from electronic waste (E‐waste) disposal. Here, recyclable and healable electronics are reported through a vitrimer‐liquid metal (LM) microdroplet composite. These electrically conductive, yet plastic‐like composites display mechanical qualities of rigid thermosets and recyclability through a dynamic covalent polymer network. The composite exhibits a high glass transition temperature, good solvent resistance, high electrical conductivity, and recyclability. The vitrimer synthesis proceeds without the need for a catalyst or a high curing temperature, which enables facile fabrication of the composite materials. The as‐synthesized vitrimer exhibits a fast relaxation time with reconfigurability and shape memory. The electrically conductive composite exhibits high electrical conductivity with LM volume loading as low as 5 vol.%. This enables the fabrication of fully vitrimer‐based circuit boards consisting of sensors and indicator LEDs integrated with LM‐vitrimer conductive wiring. Electrical self‐healing and thermally triggered material healing are further demonstrated with the composites. The vitrimer and LM‐composite provide a pathway toward fully recyclable, mechanically robust, and reconfigurable electronics, thus advancing the field of electronic materials.

Article Details

Volume / Issue Vol. 37, Issue 37
Published September 01, 2025
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (5)

D

Dong Hae Ho

Mechanical Engineering Soft Materials and Structures Lab Virginia Tech Blacksburg VA 24061 USA

M

Meng Jiang

R

Ravi Tutika

Department of Mechanical Engineering, Soft Materials and Structures Lab, Virginia Tech

J

Joshua C. Worch

Department of Chemistry and Macromolecules Innovation Institute Virginia Tech Blacksburg Virginia USA

M

Michael D. Bartlett

Department of Mechanical Engineering, Soft Materials and Structures Lab, Virginia Tech