Multifunctional Liquid Metal–2D Material Composites: Structural Design, Properties, and Applications in Advanced Electronics
Abstract
Abstract The rapid advancement of high‐integration electronics demands materials that unify thermal, electrical, and mechanical functionalities. Liquid metals (LMs) exhibit exceptional conductivity and self‐healing capabilities, but their intrinsic fluidity poses leakage risks. Incorporation with 2D materials yields LM–2D material composites with enhanced structural stability and multifunctional integration. This review systematically summarizes: 1) interfacial enhancement strategies (oxidation, heterometallic doping, polymer grafting, mechanochemistry) to improve wettability and dispersion; 2) representative structural designs, including blended, core–shell, layered, and 3D networks supported by elastomers or hydrogels; 3) key properties across different structural types, such as mechanical robustness, thermal conductivity, and electrical conductivity; 4) multifunctional applications enabled by enabled by property synergy, spanning thermal–mechanical coupling (thermal management), electrical–mechanical coupling (electromagnetic interference shielding, wearable sensors, and energy storage electrodes), and electrical–thermal–mechanical coupling (multifunctional films). Despite significant progress, critical challenges remain in scalable fabrication, long‐term reliability, and efficient recycling. To address these challenges, this review further discusses emerging directions for LM–2D material composites, including novel composite systems, responsive smart materials, multiscale manufacturing technologies, and AI‐assisted design, aiming to provide a roadmap for their development in next‐generation electronic applications.
Article Details
Authors (4)
Jingbin Yang
School of Astronautics, Beihang University 1 , Beijing 100191,
Zhenqiang Ye
College of Materials Science and Engineering Shenzhen University Shenzhen 518055 P. R. China
Guangming Chen
Ruo‐Yu Dong
School of Astronautics Beihang University Beijing 100191 China