Omni‐Directional Assembly of 2D Single‐Crystalline Metal Nanosheets

Abstract

AbstractScalable and cost‐effective fabrication of conductive films on substrates with complex geometries is crucial for industrial applications in electronics. Herein, an ultrasonic‐driven omni‐directional and selective assembly technique is introduced for the uniform deposition of 2D single‐crystalline copper nanosheets (Cu NS) onto various substrates. This method leverages cavitation‐induced forces to propel Cu NS onto hydrophilic surfaces, enabling the formation of monolayer films with largely monolayer films with some degree of nanosheet overlap. The assembly process is influenced by solvent polarity, nanosheet concentration, and ultrasonic parameters, with non‐polar solvents significantly enhancing Cu NS adsorption onto hydrophilic substrates. Furthermore, selective assembly is achieved by patterning hydrophobic and hydrophilic regions on the substrate, ensuring precise localization of Cu NS films. The practical potential of this approach is demonstrated by fabricating a Cu NS‐coated capillary tube heater, which exhibits excellent heating performance at low operating voltages. This ultrasonic‐driven and selective assembly method offers a scalable and versatile solution for producing conductive films with tailored geometries, unlocking new possibilities for applications in flexible electronics, energy storage, and wearable devices with complex structural requirements.