Oxygen Vacancy‐Abundant Molybdenum Dioxide Electrodes with Minimal Interfacial Charge‐Transfer Resistance for Ultrafast Filter Electrochemical Capacitors

S Shuhao Zhu (Institute of Materials Research Tsinghua Shenzhen International Graduate School Tsinghua University Shenzhen 518055 China) X Xinlei Cai (Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University) H Haojie Zhu (Engineering Research Center of Advanced Rare Earth Materials, Department of Chemistry) Y Yunxiang Zhao J Jianwei Zhao (Shenzhen HUASUAN Technology Co., Ltd) S Shanlin Li Y Yihang Liu (Institute of Materials Research Tsinghua Shenzhen International Graduate School Tsinghua University Shenzhen 518055 China) Z Ziqiang Wang X Xiaolan Li F Feiyu Kang C Cheng Yang (Institute of Materials Research)

Abstract

Abstract Electrochemical Capacitors (ECs) are considered capable of replacing bulky and low‐capacitance aluminum electrolytic capacitors (AECs) in alternative‐current filtering, yet regrettably, they have been plagued by slow ion migration and sluggish electrical response. Non‐carbon‐based electrode materials, while exhibiting significantly higher electric double‐layer capacitance (EDLC) compared to carbon‐based electrodes, still face the challenge of relatively high interfacial charge transfer resistance ( R ct ) that needs to be overcome. Here, a charge‐transfer kinetics enhancement strategy is demonstrated by utilizing the lattice oxygen deficiency in molybdenum dioxide (MoO 2− x ) to increase metallic electrical conductivity and the number of active sites. This strategy substantially reduces the R ct , thereby upgrading the high‐frequency performance of ECs, featuring the first high‐performance and scalable metal oxide‐based ultrafast ECs. The ECs with aqueous electrolyte achieve a phase angle ( φ ) of −80° and a specific capacitance of 966.8 µF cm −2 (3.9 F cm −3 ) at 120 Hz, while the surface‐mountable capacitors incorporating NC@MoO 2− x and EMImBF 4 demonstrate a φ of −80.3° and super‐long cycle stability (1 400 000 cycles), surpassing commercial AECs in many key performance indexes. This approach aligns with modern embedded electronic component manufacturing processes, which is about to provide profound impact to the advancement of high‐performance miniaturized components and emerging electronic technologies.

Article Details

Volume / Issue Vol. 37, Issue 47
Published November 01, 2025
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (11)

S

Shuhao Zhu

Institute of Materials Research Tsinghua Shenzhen International Graduate School Tsinghua University Shenzhen 518055 China

X

Xinlei Cai

Institute of Materials Research, Tsinghua Shenzhen International Graduate School, Tsinghua University

H

Haojie Zhu

Engineering Research Center of Advanced Rare Earth Materials, Department of Chemistry

Y

Yunxiang Zhao

J

Jianwei Zhao

Shenzhen HUASUAN Technology Co., Ltd

S

Shanlin Li

Y

Yihang Liu

Institute of Materials Research Tsinghua Shenzhen International Graduate School Tsinghua University Shenzhen 518055 China

Z

Ziqiang Wang

X

Xiaolan Li

F

Feiyu Kang

C

Cheng Yang

Institute of Materials Research