Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration (Adv. Mater. 49/2025)

M Masahito Takakuwa (Graduate School of Engineering Institute of Engineering Innovation The University of Tokyo 7‐3‐1 Hongo Bunkyo‐ku Tokyo 113‐8656 Japan) D Daishi Inoue (RIKEN Center for Emergent Matter Science (CEMS), 2-1 Hirosawa, Wako-shi, Saitama 351-0198, Japan) L Lulu Sun (School of Chemistry) M Michitaka Yamamoto S Shinjiro UMEZU D Daisuke Hashizume (RIKEN Center for Emergent Matter Science (CEMS), 2-1 Hirosawa, Wako-shi, Saitama 351-0198, Japan) T Toshihiro Itoh K Kenjiro Fukuda (Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan) T Takao Someya (Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan) T Tomoyuki Yokota

Article Details

Volume / Issue Vol. 37, Issue 49
Published December 01, 2025
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (10)

M

Masahito Takakuwa

Graduate School of Engineering Institute of Engineering Innovation The University of Tokyo 7‐3‐1 Hongo Bunkyo‐ku Tokyo 113‐8656 Japan

D

Daishi Inoue

RIKEN Center for Emergent Matter Science (CEMS), 2-1 Hirosawa, Wako-shi, Saitama 351-0198, Japan

L

Lulu Sun

School of Chemistry

M

Michitaka Yamamoto

S

Shinjiro UMEZU

D

Daisuke Hashizume

RIKEN Center for Emergent Matter Science (CEMS), 2-1 Hirosawa, Wako-shi, Saitama 351-0198, Japan

T

Toshihiro Itoh

K

Kenjiro Fukuda

Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan

T

Takao Someya

Thin-Film Device Laboratory, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan

T

Tomoyuki Yokota