Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion

K Kenji Yamaoka (Department of Macromolecular Science Graduate School of Science The University of Osaka Toyonaka Osaka 560‐0043 Japan) T Takuma Wada (Department of Macromolecular Science Graduate School of Science The University of Osaka Toyonaka Osaka 560‐0043 Japan) I Iori Ogasa (Department of Macromolecular Science Graduate School of Science The University of Osaka Toyonaka Osaka 560‐0043 Japan) T Takeru Komyo (Department of Mechanical Engineering Osaka Institute of Technology Asahi‐ku Osaka 535–8585 Japan) C Chao Luo (University of Miami , , , ,) R Ryohei Ikura (Department of Macromolecular Science Graduate School of Science The University of Osaka Toyonaka Osaka 560‐0043 Japan) M Masahiro Hino M Masako Yamada (Institute of Materials Structure Science High Energy Accelerator Research Organization (KEK) Tsukuba Ibaraki 305–0801 Japan) H Hideki Seto (Institute of Materials Structure Science High Energy Accelerator Research Organization (KEK) Tsukuba Ibaraki 305–0801 Japan) Y Yoshihisa Fujii (Department of Applied Chemistry Graduate School of Engineering Mie University Tsu Mie 514–8507 Japan) Y Yasutomo Uetsuji (Department of Mechanical Engineering Osaka Institute of Technology Asahi‐ku Osaka 535–8585 Japan) Y Yoshinori Takashima (Department of Macromolecular Science Graduate School of Science The University of Osaka Toyonaka Osaka 560‐0043 Japan)

Abstract

Abstract Controllable adhesion that enables both reuse and dismantling is a key requirement for sustainable materials and device integration. Here,a polymeric adhesion system is demonstrated based on reversible interactions at the interface, in which the association and dissociation of supramolecular complexes are externally regulated by thermal and chemical stimuli. By tuning the glass transition temperature ( T g ) of the polymers, chain mobility and complex reformation are simultaneously optimized, leading to enhanced interdiffusion and bond recombination at the adhesion interface. Neutron reflectivity (NR) measurements with deuterium labeling revealed that the interfacial width increased with annealing temperature, reaching up to 24.4 nm at 200 °C after 24 hours. The presence of reversible bonds suppressed polymer interdiffusion despite promoting adhesion strength. The resulting materials exhibit excellent reusability and dismantlability under mild stimuli, with strong potential for applications in recyclable electronics, automotive manufacturing, and temporary assembly technologies.

Article Details

Volume / Issue Vol. 38, Issue 6
Published January 01, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (12)

K

Kenji Yamaoka

Department of Macromolecular Science Graduate School of Science The University of Osaka Toyonaka Osaka 560‐0043 Japan

T

Takuma Wada

Department of Macromolecular Science Graduate School of Science The University of Osaka Toyonaka Osaka 560‐0043 Japan

I

Iori Ogasa

Department of Macromolecular Science Graduate School of Science The University of Osaka Toyonaka Osaka 560‐0043 Japan

T

Takeru Komyo

Department of Mechanical Engineering Osaka Institute of Technology Asahi‐ku Osaka 535–8585 Japan

C

Chao Luo

University of Miami , , , ,

R

Ryohei Ikura

Department of Macromolecular Science Graduate School of Science The University of Osaka Toyonaka Osaka 560‐0043 Japan

M

Masahiro Hino

M

Masako Yamada

Institute of Materials Structure Science High Energy Accelerator Research Organization (KEK) Tsukuba Ibaraki 305–0801 Japan

H

Hideki Seto

Institute of Materials Structure Science High Energy Accelerator Research Organization (KEK) Tsukuba Ibaraki 305–0801 Japan

Y

Yoshihisa Fujii

Department of Applied Chemistry Graduate School of Engineering Mie University Tsu Mie 514–8507 Japan

Y

Yasutomo Uetsuji

Department of Mechanical Engineering Osaka Institute of Technology Asahi‐ku Osaka 535–8585 Japan

Y

Yoshinori Takashima

Department of Macromolecular Science Graduate School of Science The University of Osaka Toyonaka Osaka 560‐0043 Japan