Terminations Determine Energy‐Level Alignment of Perovskite Buried Interfaces

Y Yang Li J Junnan Guo (Key Laboratory for Liquid‐Solid Structural Evolution and Processing of Materials Ministry of Education Shandong University Jinan 250061 P. R. China) J Jihua Tan (Department of Chemistry City University of Hong Kong Hong Kong SAR P. R. China) P Ping Man (Department of Chemistry and Center of Super‐Diamond & Advanced Films (COSDAF) City University of Hong Kong Kowloon China) S Shiang Li Z Zixin Zeng T Thuc Hue Ly (Department of Chemistry and Center of Super‐Diamond & Advanced Films City University of Hong Kong Kowloon China) S Sai‐Wing Tsang (Department of Materials Science and Engineering Hong Kong Institute for Clean Energy City University of Hong Kong Kowloon Tong Hong Kong SAR China) X Xinhui Lu (Department of Physics) W Weikang Wu (Key Laboratory for Liquid‐Solid Structural Evolution and Processing of Materials (MOE) Shandong University Jinan 250061 China) C Chun‐Sing Lee (Department of Chemistry City University of Hong Kong Kowloon Hong Kong SAR P. R. China) Z Zhiqiang Guan

Abstract

Abstract The “substrate‐effect”, where the semiconduction type of perovskite changes according to that of the substrate is a widely‐reported, but so far not fully understood phenomenon in the field of perovskite. The main challenge lies in the difficulty of probing and comprehending the electronic properties of perovskite buried interfaces. Here, through broadly investigating 20 buried interfaces formed between different perovskites and organic hole or electron transport materials (HTMs or ETMs), it is revealed that the substrate‐effect originates from the distinct energy‐level alignments at HTM or ETM substrates. Experimental and theoretical studies reveal that this difference stems from varying proportions of two perovskite terminations, which are determined by the interaction between substrates and perovskite crystals. With such mechanism, the semiconduction type of perovskite by controlling the proportion of surface terminations is successfully tuned. These findings provide new insights into optimizing device performance through termination engineering.

Article Details

Volume / Issue Vol. 37, Issue 40
Published October 01, 2025
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (12)

Y

Yang Li

J

Junnan Guo

Key Laboratory for Liquid‐Solid Structural Evolution and Processing of Materials Ministry of Education Shandong University Jinan 250061 P. R. China

J

Jihua Tan

Department of Chemistry City University of Hong Kong Hong Kong SAR P. R. China

P

Ping Man

Department of Chemistry and Center of Super‐Diamond & Advanced Films (COSDAF) City University of Hong Kong Kowloon China

S

Shiang Li

Z

Zixin Zeng

T

Thuc Hue Ly

Department of Chemistry and Center of Super‐Diamond & Advanced Films City University of Hong Kong Kowloon China

S

Sai‐Wing Tsang

Department of Materials Science and Engineering Hong Kong Institute for Clean Energy City University of Hong Kong Kowloon Tong Hong Kong SAR China

X

Xinhui Lu

Department of Physics

W

Weikang Wu

Key Laboratory for Liquid‐Solid Structural Evolution and Processing of Materials (MOE) Shandong University Jinan 250061 China

C

Chun‐Sing Lee

Department of Chemistry City University of Hong Kong Kowloon Hong Kong SAR P. R. China

Z

Zhiqiang Guan