Ultralight and Ablation‐Resistant Shape‐Memory Ceramizable Polymer Aerogel for Self‐Adaptive Thermal Protection

T Tuo Liu T Tiantian Xue S Shibai Yang (Key Laboratory of Synthetic and Biological Colloids Ministry of Education School of Chemical and Material Engineering Jiangnan University Wuxi 214122 P. R. China) X Xu Zhang C Chao Zhang W Wei Fan (State Key Laboratory of Silicon and Advanced Semiconductor Materials, School of Materials Science and Engineering) T Tianxi Liu (Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering)

Abstract

Abstract Deployable thermal protection systems (DTPS) for deep‐space exploration require materials that integrate lightweight design, high deformability, and extreme temperature resistance. However, existing shape memory polymers (SMPs) suffer from limited thermal stability, while shape memory ceramics (SMCs) lack rapid programmability and efficient deployment capability. To overcome these limitations, a shape‐memory ceramizable polymer aerogel (SMCPA) is developed capable of sequential self‐adaptive thermo‐responsive behavior, enabling the integration of structural deployment and thermal protection within a single material system. Upon exposure to high temperatures, SMCPA first undergoes rapid shape recovery to increase the projected area, followed by in situ ceramization at elevated temperatures to form a continuous ablation‐resistant ceramic layer. The resultant SMCPA combines ultralow density (0.12 ± 0.02 g cm −3 ), outstanding shape‐memory performance (shape fixation ratio of 97.0 ± 0.5% and shape recovery ratio of 94.2 ± 0.6%), with remarkable ablation resistance (mass ablation rate of 0.012 ± 0.003 g s −1 under 1.5 MW m −2 heat flux), outperforming conventional SMPs and SMCs in its ability to simultaneously provide programmable shape change and high‐temperature stability. This study demonstrates that SMCPA successfully reconciles the conflict between lightweight deployable structures and high‐temperature thermal protection, offering a promising material solution for next‐generation DTPS in deep‐space missions.

Article Details

Volume / Issue Vol. 38, Issue 8
Published February 01, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (7)

T

Tuo Liu

T

Tiantian Xue

S

Shibai Yang

Key Laboratory of Synthetic and Biological Colloids Ministry of Education School of Chemical and Material Engineering Jiangnan University Wuxi 214122 P. R. China

X

Xu Zhang

C

Chao Zhang

W

Wei Fan

State Key Laboratory of Silicon and Advanced Semiconductor Materials, School of Materials Science and Engineering

T

Tianxi Liu

Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering