Unlocking Wafer‐Scale 3D Photonic Systems With Ion‐Beam‐Induced Origami

Y Yi Wang R Ruixuan Zheng (New Cornerstone Science Laboratory Department of Physics University of Hong Kong Hong Kong China) C Cai Luo (Key Laboratory for Microstructural Material Physics of Hebei Province, School of Science, Yanshan University 1 , Qinhuangdao 066004,) Z Ziyi Fu (Key Laboratory for Microstructural Material Physics of Hebei Province, School of Science, Yanshan University 1 , Qinhuangdao 066004,) N Nannan Hu E Enbo Gao (Beijing National Laboratory For Condensed Matter Physics Institute of Physics Chinese Academy of Sciences Beijing China) G Gaojing Liu P Peng Bao W Weikang Fang (Beijing National Laboratory For Condensed Matter Physics Institute of Physics Chinese Academy of Sciences Beijing China) A Aizi Jin (Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 2 , Beijing 100190,) B Baoli Liu (Education and Research Department, Beijing Changier Education Foundation) B Baogang Quan (Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 2 , Beijing 100190,) G Geng Li (Department of Chemistry, State Key Laboratory of Marine Pollution, City University of Hong Kong, Hong Kong 999077, P. R. China) X Xiaofeng Fan S Sha Hu (College of Physics, Henan University of Technology 3 , Zhengzhou 450001,) Y Yang Guo (Department of Materials Science and Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon 999077, Hong Kong SAR, China) C Changzhi Gu (Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 2 , Beijing 100190,)

Abstract

ABSTRACT Scalable manufacturing of three‐dimensional (3D) micro‐/nano‐architectures with nanometric precision remains a pivotal challenge in photonics. Here, we introduce a parallel broad‐beam ion beam etching (IBE) technique that decouples this fundamental trade‐off, enabling the simultaneous and uniform transformation of two‐dimensional (2D) patterns into well‐defined 3D geometries across entire 4‐inch wafers. The IBE platform achieves angular uniformity exceeding 97% and reduces fabrication time by over two orders of magnitude compared to serial focused‐ion‐beam (FIB) methods. Leveraging this approach, we fabricate two distinct functional devices: a chiral 3D bending metasurface with a giant experimental circular dichroism of 0.8 in the mid‐infrared, and a collectively buckled plasmonic grating whose resonance is dynamically tunable over 150 nm in the visible spectrum via curvature control. This technology uniquely combines nanoscale precision with wafer‐scale throughput, enabling the construction of 3D metasurfaces via meta‐atom assembly and the global modulation of optical responses. Our work establishes a versatile platform that bridges the gap between design complexity and scalable manufacturing for next‐generation 3D integrated photonics.

Article Details

Volume / Issue Vol. 38, Issue 44
Published August 01, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (17)

Y

Yi Wang

R

Ruixuan Zheng

New Cornerstone Science Laboratory Department of Physics University of Hong Kong Hong Kong China

C

Cai Luo

Key Laboratory for Microstructural Material Physics of Hebei Province, School of Science, Yanshan University 1 , Qinhuangdao 066004,

Z

Ziyi Fu

Key Laboratory for Microstructural Material Physics of Hebei Province, School of Science, Yanshan University 1 , Qinhuangdao 066004,

N

Nannan Hu

E

Enbo Gao

Beijing National Laboratory For Condensed Matter Physics Institute of Physics Chinese Academy of Sciences Beijing China

G

Gaojing Liu

P

Peng Bao

W

Weikang Fang

Beijing National Laboratory For Condensed Matter Physics Institute of Physics Chinese Academy of Sciences Beijing China

A

Aizi Jin

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 2 , Beijing 100190,

B

Baoli Liu

Education and Research Department, Beijing Changier Education Foundation

B

Baogang Quan

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 2 , Beijing 100190,

G

Geng Li

Department of Chemistry, State Key Laboratory of Marine Pollution, City University of Hong Kong, Hong Kong 999077, P. R. China

X

Xiaofeng Fan

S

Sha Hu

College of Physics, Henan University of Technology 3 , Zhengzhou 450001,

Y

Yang Guo

Department of Materials Science and Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon 999077, Hong Kong SAR, China

C

Changzhi Gu

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 2 , Beijing 100190,