Walter, K., Hoch, D. P., Hertweck, L., Balasubramanian, K., Geisler, J., Röllig, M., Neubert, T. J., Börner, H. G. (2025). Unlocking the Essence of Lignin: High‐Performance Adhesives That Bond via Thiol‐Catechol Connectivities and Debond on Electrochemical Command. Advanced Materials. https://doi.org/10.1002/adma.202510463